Design
Spec lock, RTL, verification and DFM sign-off before tape-out.
DWG NO · BL-2026-01 — SHEET 1 OF 1
Drawn to spec. Built to run.
BLUEPRINT is a semiconductor engineering house — design, fab management, advanced packaging and qualification — documented the way engineers actually work: as drawings, specs and revision-controlled sheets.
- Process Logic / MS / Power
- Package QFP / BGA / WLCSP
- Quality ISO / IATF
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LOGIC & MIXED-SIGNALADVANCED PACKAGINGWAFER FAB MANAGEMENT
RELIABILITY QUALIFICATIONDESIGN & DFTFAILURE ANALYSIS
REFERENCE DESIGNSLONG LIFECYCLE SUPPLY
LOGIC & MIXED-SIGNALADVANCED PACKAGINGWAFER FAB MANAGEMENT
RELIABILITY QUALIFICATIONDESIGN & DFTFAILURE ANALYSIS
REFERENCE DESIGNSLONG LIFECYCLE SUPPLY
Sheet 02 — Catalog
Product catalog
Current released parts, listed as the engineering department keeps them: family, function, package and status. Full specs per part in the datasheet library.
| Part | Family | Function | Package | Temp range | Interface | Status | |
|---|---|---|---|---|---|---|---|
| BP-M32-C | MCU | 32-bit control core | QFP-64 | −40 / +105 | CAN · UART · I²C | PROD | SHT |
| BP-M32-U | MCU | Ultra-low-power core | QFN-48 | −40 / +85 | SPI · UART | PROD | SHT |
| BP-PWR-DC | Power | Dual-output DC-DC | QFN-32 | −40 / +125 | — | PROD | SHT |
| BP-PWR-GD | Power | Half-bridge gate driver | SOIC-8 | −40 / +125 | PWM | PROD | SHT |
| BP-ADC-20 | Analog | 20-bit delta-sigma ADC | TSSOP-24 | −40 / +105 | SPI | PROD | SHT |
| BP-AMP-R2R | Analog | Rail-to-rail op-amp | SOT-23-5 | −40 / +125 | — | PROD | SHT |
| BP-SNS-P | Sensor | Barometric pressure | LGA-8 | −20 / +85 | I²C | SAMPLE | SHT |
| BP-PKG-BGA | Packaging | BGA assembly service | BGA-289 | — | — | SERVICE | RFQ |
Status codes: PROD = production · SAMPLE = sampling. Placeholder parts for template demo — replace with your catalog.
Sheet 03 — Process flow
Five gates, one drawing number
Every program follows the same flow diagram. Each gate has a named owner and a documented exit criterion — nothing leaves a gate unsigned.
Fab
Front-end processing with inline metrology and lot-level SPC.
Assembly
Die attach, bonding, encapsulation with x-ray inspection.
Test
Final test, burn-in and reliability stress to plan.
Qualify
First-article approval, PPAP-style release, PCN discipline.
Sheet 04 — Capabilities
Engineering capability sheets
What we do in-house, and how it is specified. Detailed capability data is shared under NDA.
IC Design
CAP-01Full digital and mixed-signal design flow with sign-off quality gates and testability built in from the floorplan.
- Digital
- RTL → synthesis → place & route → sign-off
- Analog
- Power, data conversion, references
- DFT
- Scan, BIST, fault coverage reporting
- IP
- Curated, silicon-proven block library
Fab Management
CAP-02Managed wafer supply across logic, mixed-signal and power process platforms with lot-level traceability and change control.
- Platforms
- Logic · mixed-signal · power
- Control
- Inline metrology, SPC, lot genealogy
- Change
- Documented PCN with agreed lead time
- Supply
- Multi-source wafer planning
Packaging
CAP-03Wire-bond and flip-chip assembly with thermal and signal-integrity co-design before the first substrate is cut.
- Formats
- QFP · QFN · BGA · WLCSP
- Special
- Multi-die, SiP, custom leadframes
- Inspection
- Visual, x-ray, SAM
- Thermal
- Modelled before build, verified after
Qualification
CAP-04Reliability qualification to industry-standard stress methods with full reporting and root-cause closure on every excursion.
- Stress
- HTOL · TC · HAST · ESD per plan
- Reporting
- Data packages, Weibull analysis
- Failure
- In-house FA: curve trace, de-cap, x-ray
- Release
- First-article approval gate
Sheet 05 — Quality
Certifications, stamped and current
Management systems certified to international standards. Certificate schedules and audit summaries available on request.
ISO 9001
Quality
Design, fab, assembly, test and logistics
IATF 16949
Automotive
PPAP-style release and change control
ISO 14001
Environment
Chemicals, energy and waste, measured
REACH / RoHS
Materials
Full material declarations per part
NOTE: Official certificate copies, scopes and current audit summaries are shared with qualified customers under NDA.
Request certificates
Sheet 06 — Engineering support
Reference designs
Tested, documented circuits you can drop into your board. Each reference carries a schematic, BOM, layout file and test report.
| Ref | Platform | Description | Includes | |
|---|---|---|---|---|
| REF-001 | Motor drive | 3-phase inverter with gate drivers and protection | Schematic · BOM · Layout | GET |
| REF-002 | Power tree | Dual-rail supply for mixed-signal boards | Schematic · BOM · Test report | GET |
| REF-003 | Sensor node | Low-power environmental sensing with radio | Schematic · BOM · Firmware | GET |
| REF-004 | Isolated I/O | Galvanic isolation for industrial field inputs | Schematic · BOM · Layout | GET |
| REF-005 | LED driver | Constant-current driver for automotive lighting | Schematic · BOM · EMC notes | GET |
Sheet 07 — Markets
Application sectors
Qualification depth and documentation are matched to the sector — automotive gets automotive paperwork, consumer gets consumer speed.
Automotive
Body electronics, lighting, motor control and cockpit systems with automotive-grade qualification and PPAP documentation.
- AEC-style qual
- PPAP
- Longevity
Industrial
Drives, PLCs, robotics and edge computing with wide temperature support and decade-long lifecycle commitments.
- Wide temp
- 10-yr supply
- Harsh env
IoT & Edge
Ultra-low-power sensing, connectivity and edge processing for battery-powered infrastructure.
- Low power
- Modules
- Security
Consumer
Wearables, audio and smart appliances with small form factors and fast production ramps.
- Small form
- Cost-optimized
- Fast ramp
Sheet 08 — Datasheets
Datasheet library
Revision-controlled datasheets for every released part. Filter by family; every document is dated and versioned.
| Doc no. | Part | Family | Title | Rev | Date | |
|---|---|---|---|---|---|---|
| DS-1001 | BP-M32-C | MCU | 32-bit control core datasheet | 1.7 | 2026-08-14 | |
| DS-1002 | BP-M32-U | MCU | Ultra-low-power core datasheet | 1.3 | 2026-07-02 | |
| DS-1003 | BP-PWR-DC | Power | Dual-output DC-DC datasheet | 2.0 | 2026-09-11 | |
| DS-1004 | BP-PWR-GD | Power | Half-bridge gate driver datasheet | 1.2 | 2026-06-19 | |
| DS-1005 | BP-ADC-20 | Analog | 20-bit delta-sigma ADC datasheet | 1.4 | 2026-08-30 | |
| DS-1006 | BP-AMP-R2R | Analog | Rail-to-rail op-amp datasheet | 1.1 | 2026-05-27 | |
| DS-1007 | BP-SNS-P | Sensor | Barometric pressure sensor datasheet | 0.9 | 2026-09-28 | |
| DS-1008 | BP-PKG-BGA | Packaging | BGA assembly service specification | 1.0 | 2026-08-01 | RFQ |
No documents in this family.
Sheet 09 — Footprint
Global footprint
Schematic site map — indicative locations only. Detailed site information and audit scheduling on request.
GRID — NOT TO SCALE
LAT/LON INDICATIVE
APAC — Fab partner
EMEA — Design
APAC — Assembly
AMER — Support
DESIGNEMEA design center — architecture, verification, sign-offGMT+1
FABAPAC wafer partner management — SPC, lot genealogyGMT+8
ASSEMBLYAPAC assembly & test program officeGMT+8
SUPPORTAMER field applications & sample fulfillmentGMT−8
QUALITYGlobal quality systems — audits, PCN, certificates24/7
Sheet 10 — RFQ
Request for quotation
Send the part numbers and the target. Engineering returns a quote, a qualification schedule and a named owner — within one business day.
- One business day response, typically faster
- Samples and eval kits for qualified projects
- NDA available for sensitive specifications
- Long-term supply and pricing agreements