Semiconductor design & manufacturing

Precision silicon for mission-critical electronics.

VANTA brings wafer fabrication, assembly and test under one quality system — so industrial, automotive and infrastructure builders get components that last as long as the machines they power.

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Engineer inspecting semiconductor manufacturing equipment
Manufacturing Class-controlled facilities One quality system from wafer start to final test.
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Regional engineering hubs
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Product families
Wafer fabricationAdvanced packagingAutomotive quality Long lifecycle supplyFailure analysisReference designs Reliability qualificationFull traceability Wafer fabricationAdvanced packagingAutomotive quality Long lifecycle supplyFailure analysisReference designs Reliability qualificationFull traceability
Capabilities

Three disciplines, one accountable partner.

Design, fabrication and assembly rarely live under one roof. At VANTA they do — which changes how problems get solved and how long supply lasts.

01
Silicon die on a printed circuit board
Design services

From architecture to sign-off.

RTL design, verification and physical implementation with testability engineered in — not added later. We sign off timing, power and manufacturability before a single wafer starts.

  • DigitalRTL-to-GDS with DFM sign-off
  • AnalogMixed-signal and power design
  • DFTScan, BIST and fault coverage
  • PackagingThermal and signal-integrity co-design
Talk to the design team
02
Automated semiconductor fabrication equipment
Wafer fabrication

Advanced-node processing, quietly consistent.

Class-controlled cleanrooms, inline metrology and statistical process control on every lot. Our platforms span logic, mixed-signal and power process families with full change-control discipline.

  • LogicPerformance and low-leakage platforms
  • PowerHigh-voltage and wide-bandgap-compatible
  • MetrologyInline inspection at every gate
  • ControlLot-level traceability, PCN discipline
See the process flow
03
Microchip held over circuit board with tweezers
Assembly, test & packaging

From die to dependable device.

Wire-bond and flip-chip assembly, full final test, burn-in and reliability screening. QFP, BGA, WLCSP and custom multi-die modules — qualified once, shipped for years.

  • AssemblyDie attach, wire bond, flip chip
  • TestFinal test, burn-in, screening
  • PackagesQFP / BGA / WLCSP / modules
  • ReliabilityIndustry-standard stress methods
Browse the library
Process

A flow with no silent hand-offs.

Five gates, each with an engineering owner and a documented exit criterion. You know where your device is at every step.

Gate 01

Design & tape-out

Specification lock, RTL freeze, verification sign-off and mask preparation with DFM checks.

Gate 02

Wafer fabrication

Front-end processing with inline metrology, lot sampling and parametric monitoring at every module.

Gate 03

Assembly & package

Die preparation, attach, bonding and encapsulation with visual and x-ray inspection before sealing.

Gate 04

Test & qualification

Final electrical test, burn-in where specified, and reliability stress to the agreed qualification plan.

Gate 05

Release & lifecycle

PPAP-style documentation, first-article approval and change notification discipline for the life of the product.

Product families

A focused catalog, built for long life.

We would rather qualify a few families deeply than ship many shallowly. Every family below carries the same documentation and support depth.

01

Microcontrollers & Processors

Industrial-grade 32-bit devices with security engines, wide temperature support and long-lifetime supply commitments.

  • Security
  • Wide temp
  • 10-yr supply
→ 02

Power Management

DC-DC converters, regulators and gate drivers tuned for efficiency and thermal reliability in industrial enclosures.

  • DC-DC
  • LDO
  • Gate drivers
→ 03

Analog & Mixed-Signal

Converters, amplifiers and references with calibration-grade precision for measurement and control loops.

  • ADC / DAC
  • Op-amps
  • References
→ 04

Sensors & MEMS

Motion, pressure and environmental sensors with factory calibration and stable long-term drift performance.

  • Motion
  • Pressure
  • Environmental
→ 05

Connectivity & RF

Transceivers and pre-certified modules for industrial wireless — designed once, certified once, reused everywhere.

  • Sub-GHz
  • BLE
  • Modules
→ 06

Discretes & Protection

MOSFETs, diodes, ESD protection and TVS devices for power stages and ruggedized inputs.

  • MOSFET
  • ESD / TVS
  • Diodes
→
Quality & certifications

Quality you can audit, not just admire.

Certified management systems, documented evidence, and a door that is always open to customer audits.

ISO 9001

Quality management

Certified quality management system spanning design, fabrication, assembly, test and logistics — audited continuously, not annually.

IATF 16949

Automotive grade

Automotive quality systems with PPAP-style submission, change control and zero-defect methodology for vehicle electronics.

ISO 14001

Environmental

Certified environmental management across manufacturing sites — chemicals, energy, waste and water, measured and reduced.

Certificate copies on request. Official certificate schedules, scopes and latest audit summaries are shared under NDA with qualified customers.

Request documentation
Application markets

Engineered per market. Documented per market.

The same die behaves differently in a vehicle than in a router. We qualify, document and support them accordingly.

Automotive electronics control unit
01 — Automotive

Vehicle electronics

Body control, lighting, motor drive and cockpit systems with automotive-grade qualification and PPAP documentation.

Industrial control cabinets in a factory
02 — Industrial

Drives, PLCs & robotics

Wide-temperature, long-lifecycle devices for automation equipment that must run for a decade without surprises.

IoT edge computing device
03 — IoT & edge

Connected infrastructure

Low-power sensing and connectivity for meters, trackers and edge nodes that count their battery life in years.

Consumer electronics internals
04 — Consumer

Smart devices

Compact, cost-optimized silicon for wearables, audio and appliances with fast ramps and tight form factors.

Datasheet library

Every number, verified and versioned.

Datasheets, application notes and qualification summaries for the entire catalog — revision-controlled and dated.

Placeholder library — connect your document store
Part numberFamilyDescriptionPackageRev
VT-M32-SECMicrocontroller32-bit secure MCU, industrial tempQFP-1002.1PDF
VT-M32-LPMicrocontrollerUltra-low-power MCU, battery classQFN-641.3PDF
VT-PM-BUCKPower managementSynchronous buck converterQFN-201.8PDF
VT-ADC-24BAnalog24-bit delta-sigma ADCTSSOP-241.2PDF
VT-SNS-IMUSensors & MEMS6-axis inertial measurement unitLGA-142.0PDF
VT-RF-SUBGConnectivitySub-GHz transceiver moduleModule1.5PDF
VT-DS-TVSHVDiscretesHigh-voltage TVS protectionSOD-1231.1PDF
VT-PKG-QFPPackagingQFP assembly serviceQFP-144—RFQ
Global footprint

Close to your line, wherever it runs.

APAC

Manufacturing hub

Wafer fabrication, assembly, test and logistics campus serving regional and global production programs.

  • Fab
  • Assembly & test
  • Logistics
EMEA

Design & engineering

Design center and application engineering for European industrial and automotive programs.

  • Design
  • FAE
  • Quality
AMER

Sales & support

Sales engineering, sample fulfillment and regional technical support for North and South America.

  • Sales
  • Samples
  • FAE
Schematic — indicative, not to scale
Request for quotation

Give us a part number. Get back a plan.

Volume, timeline, target price — send what you have. An applications engineer responds with samples, pricing and a qualification schedule.

  • Response within one business day, typically faster
  • Free samples and evaluation kits for qualified projects
  • NDA available for sensitive specifications
  • Long-term supply and pricing agreements

Demo form — no data is transmitted. Wire to your CRM or email endpoint before launch.