Microcontrollers & SoCs
Low-power to performance-class cores with on-chip flash, security engines and rich peripheral sets, qualified across industrial temperature ranges.
View family
Semiconductor design & manufacturing
Silicon, engineered beyond the wafer.
IONFORGE pairs advanced wafer fabrication with in-house assembly, test and packaging. From first schematic to qualified production volume, one partner carries your device from concept to the field.
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Wafer fabricationAdvanced packagingMixed-signal design
Power devicesAssembly & testFailure analysis
Reference designsReliability qualification
Wafer fabricationAdvanced packagingMixed-signal design
Power devicesAssembly & testFailure analysis
Reference designsReliability qualification
Product lines
Four families. One silicon supply chain.
Every family is designed, fabricated and packaged under one quality system, so bill-of-materials risk stays low and lifecycle support stays long.
Power & Discrete Devices
MOSFETs, diodes and power-management ICs engineered for efficiency and thermal headroom in switching supplies, motor drives and battery systems.
View familyAnalog & Mixed-Signal
Data converters, op-amps, references and sensor interfaces with calibration-grade precision for measurement and control loops.
View familySensors, RF & Modules
Environmental sensing, connectivity front-ends and pre-certified modules that shorten time-to-market for connected products.
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Process & technology
From tape-out to qualified volume.
Our manufacturing flow is designed for transparency. Every step is traceable, every lot is measurable, and engineering decisions are shared with you at each gate.
Design & tape-out
RTL-to-GDS services with sign-off for timing, power and DFM. Reference flows, IP libraries and testability planning are included from day one.
Wafer fabrication
Advanced-node front-end processing in class-controlled cleanrooms, with inline metrology and statistical process control on every lot. Process platforms span logic, mixed-signal and power.
Assembly, test & packaging
Die attach, wire-bond and flip-chip assembly with full final test, burn-in and reliability screening. Package formats include QFP, BGA, WLCSP and custom multi-die modules.
Qualification & lifecycle
Device qualification to industry-standard stress methods, change notification discipline and long-term supply commitments keep your design in production for as long as your product lives.
Detailed process capabilities and technology roadmaps are shared under NDA. Contact our engineering team for the full technology deck.
Quality & certifications
Certified systems. Documented evidence.
Quality is managed as a manufacturing discipline, not a department. Our management systems are certified to international standards and audited continuously.
Quality management
Certified quality management system covering design, fabrication, assembly, test and logistics operations end to end.
Automotive quality
Automotive-grade quality systems with PPAP-style documentation, change control and zero-defect methodology for vehicle electronics.
Environmental
Environmental management across fabs and assembly sites, covering waste, chemicals and energy in manufacturing operations.
Material compliance
Full material declarations and compliance statements for EU REACH, RoHS and regional substance restrictions across all product lines.
Certificate copies — official certificate schedules, scopes and audit summaries are available on request. Contact quality@ionforge.example to request current documentation.
Design & engineering support
An engineering bench behind every design.
From architecture review to field returns, our engineers work inside your design cycle — not outside it.
ENG-01
Reference designs
Tested, documented circuit references that shorten schematic and layout cycles.
- Power trees
- Sensor front-ends
- Connectivity
ENG-02
Application engineering
Field application engineers embedded in your review and bring-up milestones.
- Design reviews
- Board bring-up
- Tuning
ENG-03
Prototyping & shuttles
Multi-project wafer runs and quick-turn assembly for early silicon validation.
- MPW shuttles
- Quick-turn AT
- Eval kits
ENG-04
Failure analysis
In-house FA lab with electrical, thermal and physical analysis on returned devices.
- Curve trace
- X-ray / de-cap
- Root-cause reports
Application markets
Silicon for the machines around us.
Devices engineered per market — the same die, qualified differently, documented differently, supported differently.
01
Automotive
Body electronics, lighting, motor control and cockpit systems.
- AEC-style qual
- PPAP
- Longevity
02
Industrial
Drives, PLCs, robotics and ruggedized edge computing.
- Wide temp
- Long lifecycle
- Harsh env
03
IoT & smart devices
Ultra-low-power sensing, connectivity and edge AI accelerators.
- Low power
- RF ready
- Modules
04
Consumer electronics
Wearables, audio, appliances and fast-moving smart products.
- Cost-optimized
- Small form
- Fast ramp
Datasheet library
Documentation, one download away.
Full specifications, application notes and qualification summaries for every released part.
Placeholder library — connect your document store
| Part number | Family | Function | Package | Status | Rev | |
|---|---|---|---|---|---|---|
| IF-MCU-32A | Microcontroller | 32-bit, security | QFP-64 | Production | 1.4 | |
| IF-MCU-32L | Microcontroller | Ultra-low power | QFN-48 | Production | 1.1 | |
| IF-PWR-600V | Power device | HV MOSFET | DPAK | Production | 2.0 | |
| IF-PMIC-4CH | Power management | 4-channel PMIC | QFN-32 | Production | 1.2 | |
| IF-ADC-16B | Analog | 16-bit ADC | TSSOP-20 | Production | 1.0 | |
| IF-SNS-TMP | Sensor | Temp + humidity | LGA-8 | Sampling | 0.9 | |
| IF-RF-24G | RF module | 2.4 GHz transceiver | Module | Production | 1.6 | |
| IF-PKG-BGA | Packaging | BGA assembly service | BGA-289 | Service | — | RFQ |
* Datasheet rows shown are placeholder entries for the template demo. Wire this table to your real document library before launch.
Global footprint
Manufacturing, where your supply chain needs it.
Regional hubs for engineering, fabrication, assembly and logistics — indicative locations shown; detailed site information available on request.
/ Lat — Region grid
/ Schematic — not to scale
/ Hub markers
APAC — Fab & assembly hub
Europe — Design center
Americas — Sales & FAE
APAC — Test & logistics
Follow-the-sun support
Engineering offices across three regions mean your ticket is answered within one working day, wherever your line is.
Talk to a regional engineer →
Request for quotation
Send us your spec. We will send back a plan.
Share your requirements — part number, target volume, timeline — and an application engineer will respond with pricing, samples and a qualification schedule.
- Response within one business day
- Samples and evaluation kits available for qualified projects
- NDA available for sensitive specifications
- Volume pricing and long-term supply agreements